Proceedings : IMAPS Conference and Exhibition on Ceramic Interconnect Technology : the next generation : April 7-9 2003, The Westin Hotel, Denver, Colorado / sponsored by International Microelectronics and Packaging Society (IMAPS) & Ceramic Interconnect Initiative ; endorsed by the American Ceramic Society (ACerS) ; [assembled and edited by the Technical Program Committee and the IMAPS staff].

Title
Proceedings : IMAPS Conference and Exhibition on Ceramic Interconnect Technology : the next generation : April 7-9 2003, The Westin Hotel, Denver, Colorado / sponsored by International Microelectronics and Packaging Society (IMAPS) & Ceramic Interconnect Initiative ; endorsed by the American Ceramic Society (ACerS) ; [assembled and edited by the Technical Program Committee and the IMAPS staff].
Author
IMAPS Conference and Exhibition on Ceramic Interconnect Technology (2003 : Denver, Colo.) http://id.loc.gov/authorities/names/no2003090696
Publication
Bellingham, Wash., USA : SPIE, [2003], ©2003.

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Description
254 pages : illustrations; 28 cm.
Series Statement
SPIE proceedings series, 0277-786X ; v. 5231
Uniform Title
Proceedings of SPIE--the International Society for Optical Engineering ; v. 5231.
Alternative Title
  • 2003 Ceramic Interconnect Technology Conference
  • Ceramic Interconnect Technology Conference
  • Ceramic interconnect technology : the next generation
  • IMAPS Conference and Exhibition on Ceramic Interconnect Technology
Bibliography (note)
  • Includes bibliographical references and index.
Contents
Dual Mode Switch Duplexer Modules Packaged in LTCC with 3D FEM / Toshio Nishikawa -- Development of Miniature Bluetooth Module for Manufacturability using a System-in-Package Approach / Andrew Cervin-Lawry, Kamal Ali, Tom Bernacki, Sukhi Binapal, Cristian Miortescu, Atin Patel, Paul Woo and Lisa Woodward -- Design Considerations for Hybrid LTCC-RF-Filters / Jens Muller -- LTCC Based Slow Wave Filters for Wireless and Handheld Products / F. Magableh, V. Wang, A. Elshabini and F. Barlow -- Interconnection Reliability Studies of Some Ceramic Components and the Introduction of the Results into MTBF Calculations / Olli Salmela, Klas Andersson, Jussi Sarkka and Markku Tammenmaa -- Thermomechanical Responses and Reliability of LTCC Solder Attachments for Wireless Applications / Chia-Yu Fu and Peter Vo -- Side-Fill Underfill for RF SAW Packaging / Michael Chang, Brian Lu, Ken Wu and Tarou Fukui -- Overmolded LTCC RF Modules / Jicheng "Jeff" Yang, Robert Darveaux, Adrian Federigan, Tony Arellano, Seok Bong Kim and Jin Young Khim -- Ultra Wide Frequency Band Ceramic Package and Assembly Technology / Y. Tsukiyama, M. Shiobara, M. Hashimoto and A. Osakada -- Broadband Electrical Design and Modeling of Packages Integrated in LTCC-Substrate / M. Nisznansky, Ch. Ziegler, L.-P. Schmidt, R. Hocke and O. Wohlgemuth -- Telecom MEMS Packaging in Ceramics / David A. Ramsey, Nagesh R. Basavanhally and Yee L. Low -- Screen Printed Feature Size Capabilities / Daniel C. Hughes and Steve E. Ernster -- A High Density Flip-Chip Interconnect Technology on Multilayer Ceramic Substrates for Automotive Controller Applications / C. W. Berlin, D. H. R. Sarma, W. A. Sozansky and D. W. Zimmerman -- Continued Study in Power Module Substrates for Automotive Harsh Environments / Keith Easler -- Packaging and Interconnect for RF and Microwave / Paul Collander and George Passiopoulos -- Design and Manufacturing of Integrated Modules for Wireless and RF Applications using Multi-Mix Microtechnology and Green Tape LTCC Materials / James J. Logothetis, Daniel I. Amey and Timothy P. Mobley -- LTCC Technology for High Performance Low Power Base Station Applications / George Passiopoulos -- Ceramic Triple-Mode Delay Filter for Cellular Base Station Applications / Weili Wang, William Wilber, William Engst and Ricardo Espina -- The Measurement and Practical Significance of Complex Permittivity at mm-wave Frequencies / Charles Free and Zhengrong Tian -- Broadband Permittivity and Loss Tangent Measurements using a Split-Cylinder Resonator / Michael D. Janezic, James Baker-Jarvis and Edward F. Kuester -- Four-Port On-Wafer Measurements of Coupled Transmission Lines on LTCC / Ch. Ziegler, M. Nisznansky, L.-P. Schmidt, R. Hocke and O. Wohlgemuth -- Using Defect Information to Manage LTCC Yield and Manufacturing Costs / Benjamin Arnold -- Factors Affecting Characteristics of Thick Film Voltage Tunable Dielectric Materials / Xiaohong Tang, Marion Ed. Ellis, Frederick Duvall, Barry Treadway, Elijah Underbill and Luna Chiu -- Dielectric Material and Waveguide Development for Low Temperature Co-fired Ceramics / Michael T. Lanagan, Chiping Wang, Sayed-Khaled Rajab, Clive Randall, Hyo-Tae Kim, Hsin-Cheng Chen and Kuen-Fwu Fuh -- Constrained-Sintered Material Systems for Interconnects and Packages / Christopher R. Needes, Carl B. Wang, Kenneth W. Hang, Michael F. Barker, Daniel I. Amey, Michael A. Smith and Kenneth E. Souders -- Development of Integrated High Value Resistors on Novel Substrates / Bruce A. Tuttle, David P. Williams, Walter R. Olson, Paul G. Clem, Bruce King and Michael Renn -- Compact Stacked Tandem Coupler in LTCC / Michael J. Lee and John W. Gipprich -- Design of Compact Multi-Level Via-Less Bandpass Filters with Higher Harmonic Suppression / Kala Gururajan and Raghu K. Settaluri -- Miniaturized High Performance Low-pass and Bandstop Filters for Wireless Applications / Harish Peddibhotla and Raghu K. Settaluri -- Design of Mimaturised RF Filters in LTCC / Sarmad Al-Taci and George Passiopoulos -- Characterization and Control of Low Temperature Co-Fire Ceramic (LTCC) Sintering / C. B. DiAntonio, D. N. Bencoe and K. G. Ewsuk -- Trends in LTCC Processing / Dean Anderson -- The Co-sintering of LTCC Materials / Terry J. Carino -- A Model System for Interfacial Reactions in LTCC Materials / Lawrence P. Cook, Winnie Wong-Ng, Peter Schenck, Mark Vaudin and Julia Suh -- Manufacturability and Reliability of Trimmed Buried Resistors in LTCC / Waleed Ehrhardt, Heiko Thust and Jens Muller -- Dielectric and Magnetic Materials for Integrated Passives / A. H. Feingold, M. Heinz and R. L. Wahlers -- High k LTCC System for High Frequency Applications / Yong S. Cho, Kenneth W. Hang, Carl B. Wang, Kenneth E. Souders, Diptarka Majumdar, Daniel Amey and Christopher R. Needes -- Performance of Low-Ohmic Co-Fired Buried Resistors in A6S Tape / Michail Moroz -- Embedded Heat Exchanger in LTCC Substrate / Hari Adluru, Marc A. Zampino, Yanqiug Liu and W. Kinzy Jones -- LTCC Based MEMS Impingement Coolers / K. Saxena, G. Wang, S. Ang, A. Elshabini and F. Barlow -- Microfluidics for Thermal Management: Applications, Fabrication, and Demonstration in LTCC / Brian Smith, Michael Pleskach and Carol Gamlen -- Novel Structures in Ceramic Interconnect Technology / Ken Peterson, Steven Rohde, Tim Turner, Robert Stokes and Adrian Casias -- Ceramic Packaging for MEMS-Based Microsystems / Jonathan S. Custer -- Joining Small Components with Reactive Multilayer Foils / T. P. Weihs and O. M. Knio -- Ion Mobility Spectrometer Fabricated in LTCC / D. G. Plumlee, J. Hartman, A. J. Moll, M. Tam, P. Dwivedi and H. H. Hill, Jr. -- Polymer-Derived Ceramic MEMS: Science and Technology / L. A. Liew and R. Raj -- Microdischarge Arrays in Ceramics and Semiconductors Multilayer Structures: Photonic Devices for Emission and Detection / J. G. Eden.
ISBN
  • 0930815688 (IMAPS)
  • 0819451053 (SPIE)
Owning Institutions
Columbia University Libraries