Research Catalog

Title

Electrical performance of electronic packaging : November 2-4, 1994, Monterey Plaza Hotel, Monterey, California / sponsored by the IEEE Microwave Theory and Techniques Society and the IEEE Components, Packaging and Manufacturing Technology Society.

Author

Topical Meeting on Electrical Performance of Electronic Packaging (3rd : 1994 : Monterey, Calif.)

Publication

[New York] : Institute of Electrical and Electronics Engineers, [1994]

Items in the Library & Off-site

Details

Additional Authors

• IEEE Microwave Theory and Techniques Society.
• Components, Packaging & Manufacturing Technology Society.
• Topical Meeting on Electrical Performance of Electronic Packaging (3rd : 1994 : Monterey, Calif.)

Description

vii, 266 pages : illustrations; 28 cm

Alternative Title

IEEE 3rd Topical Meeting on Electrical Performance of Electronic Packaging.

Subjects

• Materials > Electric properties > Congresses
• Electronic packaging > Congresses

Note

• Cover title: IEEE 3rd Topical Meeting on Electrical Performance of Electronic Packaging.
• "IEEE Catalog Number: 94TH8022."

Bibliography (note)

• Includes bibliographical references and index.

Contents

A Comparison of Power Supply Planes in Thick and Thin Film MCM's -- Pulse Signaling Using Capacitively-Coupled CMOS -- CBGA VS. CQFP: Electrical Performance Comparison and Tradeoff Study -- Electrical Performance of Flip-Chip PBGA vs. CBGA -- Numerical Optimization of High Frequency Properties of Vias and Bends in MCM-L Technology -- Electrical Performance of Card-on-Board Interconnections For High-Speed Digital Applications -- Metrics for RLC Transmission Line Termination -- CAD Tools for Managing Signal Integrity and Congestion Simultaneously -- Influence of Parameter Distribution on Simultaneous Switching Noise (SSN) for CMOS Output Drivers -- Simultaneous Switching Noise Predictors for CMOS OCDs -- A Model to Hardware Comparison of Simultaneous Switching Noise on a CMOS Chip -- The Role of Component Packaging in System Electromagnetic Compatibility -- Evaluation of a New Measurement Set-up for the Accurate Characterization of the Near-Field Radiated Emission of Printed Circuit Boards -- Calculation of Far Zone Electromagnetic Fields Radiated From Structures in Multilayer Printed Circuit Boards -- Progress in Circuit-Oriented Techniques for Electrical Interconnects and Package (EIP) Modelling -- Spectral Technique for Simulation of Circuits and Systems with Emphasis on Signal Integrity -- Limitations of Electromagnetic-Based Package Analysis Tools -- A Multipole-Accelerated Boundary-Element Approach To Transient Simulations of Three-Dimensional Integrated Circuit Interconnect -- A Rigorous Full-Wave Analysis of Electrical Interconnects for VLSI Packages -- Effects of Discontinuities (VIAS) on High Speed Interconnects -- Time Domain Interconnect Model Generation of Alloy-42 Lead Frames -- Line Parameter Characterization of Laser Deposited Lines -- Application of Electromagnetic Field Simulations to the Analysis of Complex Active Circuits with Lumped Elements -- Electrical Characterization of a 3-D Plastic IC Package (MCM-V) -- Simultaneous Switching Noise Measurement on a CMOS Chip on an MLC SCM -- Electrical Characteristics of Multiconductor Interconnects with Perforated Reference Planes -- Decoupling Capacitor Calculations for CMOS Circuits -- Modeling Nonuniform Transmission Lines Using Spice Software -- Effects of Losses in Power and Ground Planes in the Simulation of Simultaneous Switching Noise -- Packaging and Thin-Film Truncation Effects on Thin-Film Open End Microstrip Line for Miniature Multilayer MMICs -- Transient Analysis of Coupled Transmission Lines Using Scattering Parameter Based Macromodels -- Simulation of Multi-Chip Module Package Resonance Using Commercial Finite Element Electromagnetic Software -- Laddering Wave in Serpentine Delay Line -- Use of Periodic Structure Approach to Model Packaged MMIC and Interconnects -- Lossy Interconnect Modeling from TDR/T Measurements -- Emerging Microwave Packaging Technologies -- Millimeter-Wave MMIC Interconnects Using Electromagnetic Field Coupling -- Leakage Control in Conductor-Backed Uniplanar Structures -- Modeling of Multiconductor Microstrip Bend Discontinuities -- A Materials Database for Microwave Packaging Design -- Packaging for Wireless Communication -- A Network Modeling Approach For Effects of Metallic Packages on Microstrip Circuit Performance -- A Low-Cost Multilayer Thick Film Based T/R Module Package For Phased Array Applications -- A Compact LTCC Multilayer Multiport Stripline Coupler Network for Wideband Low Loss Power Combining/Splitting -- De-embedding Procedures for Characterization of Interconnect and Package Discontinuities -- Accuracy in Time Domain Transmission Line Measurements -- IC Package and Interconnect Characterization Using Enhanced Accuracy Time Domain Reflectometry -- DC to 100 GHz Chip-to-Chip Interconnects with Reduced Tolerance Sensitivity by Adaptive Wirebonding -- Interconnect Characterization Using Time Domain Reflectometry -- Electrical Characterization of Interconnects and Materials for High Speed Computer Packaging System -- Measurement of Package Inductance and Capacitance Matrices -- Circuit Modelling of Two-Port Interconnection Structures Based on Causality -- Measurements on the Electrical Properties of Transmission Lines on Flexible Circuits -- Electromagnetic Modeling of Simultaneous Switching Noise in Power and Ground Planes in Electronic Packages -- Model of Interaction Between Signal Vias and Metal Planes in Electronics Packaging -- Inductance Computations of Multiple Arbitrarily Shaped Planes -- Full Wave Characterization of a Through Hole Via Discontinuity in Multi-Layered Packaging -- European Packaging Research and Development Activities -- The Interconnect Mesh Power System (IMPS) MCM Topology -- Electrical Packaging Impact on Source Components in Optical Interconnects -- Simulation of Losses in Hybrid Opto-electronic Die Stack -- Direct Computation of Reduced-Order Models for Circuit Simulation of 3-D Interconnect Structures -- Interconnect Series Impedance Determination Using a Surface Ribbon Method -- Efficient Capacitance Extraction of 3D Structures Using Generalized Pre-Corrected FFT Methods -- Fast Capacitance Computations for Conducting Structures Embedded in a Multilayered Dielectric Medium Using the Fast Multipole Algorithm and a Closed Form Green's Function -- An Efficient and Accurate Method for Estimating Crosstalk in Multiconductor Coupled Transmission Lines.

ISBN

• 0780324110 (softbound)
• 0780324129 (microfiche)

OCLC

ocm31726574

Owning Institutions

Columbia University Libraries